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CVE-2025-59612 is a memory corruption vulnerability in Qualcomm’s Windows Compute drivers, rooted in their handling of trusted application requests. The flaw is triggered when an attacker sends an incorrectly formatted trusted application request to the driver.
The technical root cause is a lack of proper input validation for the size and structure of data received from a trusted application. When a request is processed, the driver fails to verify that the incoming data fits within a pre-allocated buffer on the stack.
Specifically, the driver trusts the application to provide a valid request structure. When a malformed request is sent, the driver misinterprets the data, leading to a buffer overflow. Because the buffer resides on the stack, an attacker can overwrite critical return addresses or function pointers. This effectively gives the attacker control over the program’s execution flow, potentially allowing the injection and execution of arbitrary code.
The vulnerability is classified as CWE-121: Stack-based Buffer Overflow. The CVSS 3.1 score is 6.7 (Medium), with the vector string CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H. This indicates that the attack requires local access and high privileges but no user interaction, and successful exploitation can lead to a full system compromise.
The vulnerability was reported to Qualcomm on June 30, 2025, and affects a range of Qualcomm Snapdragon Compute and connectivity chipsets, including the FastConnect 6700, 6900, 7800, and various Snapdragon 7c/8cx platforms.
DailyCVE Form:
Platform: Windows Compute
Version: Varies by chipset
Vulnerability : Stack Buffer Overflow
Severity: Medium (CVSS 6.7)
date: June 30, 2025
Prediction: June 1, 2026
What Undercode Say:
Identify vulnerable driver version (example)
Get-ItemProperty "C:\Windows\System32\drivers\qccmn.sys" | Select-Object VersionInfo
Check Windows Build for Qualcomm Driver (example)
Get-WmiObject Win32_PnPSignedDriver | Where-Object {$_.DeviceName -like "Qualcomm"}
Monitor for anomalous IOCTL calls (using Sysmon config)
Sysmon64.exe -accepteula -i config.xml
Verify patch level from Qualcomm Security Bulletin
https://docs.qualcomm.com/securitybulletin/june-2026-bulletin.html
Exploit:
A successful exploitation requires the attacker to have local access and high privileges on the target system. The attacker would craft a malicious trusted application that sends a specific IOCTL (Input/Output Control) request to the vulnerable Qualcomm driver. Due to the lack of boundary checks, the attacker can overflow a stack buffer, overwriting the return address. This allows for arbitrary code execution within the kernel context. While no public exploit is currently available, the flaw is considered easy to exploit due to the low attack complexity.
Protection:
- Update Drivers: Obtain and install the latest driver updates from your device manufacturer or the June 2026 Qualcomm Security Bulletin.
- Restrict Local Access: Enforce strict physical and logical access controls to the system, as the attack requires local access and high privileges.
- Enable Windows Defender Application Control (WDAC): Limit execution of untrusted applications to prevent malicious trusted app code from running.
- Monitor for IOCTL Calls: Use security tools (e.g., Sysmon) to monitor for suspicious IOCTL calls to Qualcomm drivers.
Impact:
- Confidentiality: An attacker could read sensitive kernel memory.
- Integrity: The attacker can modify system files or driver behavior.
- Availability: The overflow can cause system crashes (Blue Screen of Death), leading to denial of service.
- Privilege Escalation: Although the vulnerability requires high privileges to exploit, successful arbitrary code execution in the kernel can allow the attacker to bypass security mechanisms and maintain persistence.
Affected Chipsets Include: Cologne, FastConnect 6700/6900/7800, IQX5121, IQX7181, QCA0000, QCM5430, QCM6490, Qualcomm Video Collaboration VC3 Platform, SC8380XP, Snapdragon 7c+ Gen 3 Compute, Snapdragon 8cx Gen 3 Compute Platform, and others listed in the bulletin.
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Sources:
Reported By: nvd.nist.gov
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